The India Electronics and Semiconductor Association (IESA) and the Singapore Semiconductor Industries Association (SSIA) have signed a Memorandum of Understanding (MoU) to bolster their electronics system design and manufacturing (ESDM) ecosystems. The agreement was formalized by Ang Wee Seng, Executive Director of SSIA, and Ashok Chandak, President of IESA, during an industry conference in Singapore.

The MoU outlines a collaborative effort to strengthen the ESDM sector in both countries. IESA plans to enhance the ecosystem by organizing regional and national events and increasing SSIA’s visibility among its members. Both organizations will work together on a joint study to explore business opportunities for small and medium enterprises (SMEs) in Singapore and India.

The partnership aims to leverage the strengths of both associations to foster growth and innovation in electronics manufacturing. VVeerappan, Chairman of IESA, highlighted the importance of the collaboration in enhancing the resilience and competitiveness of the sector.

Ang Wee Seng of SSIA expressed confidence that the partnership will significantly boost the global presence of both countries in the semiconductor industry. The MoU represents a strategic move to support the development of the semiconductor sector and explore new opportunities within India and Singapore.

Source: Economic Times