Prime Minister Narendra Modi stated that the establishment of the HCL-Foxconn semiconductor facility in Uttar Pradesh signifies a significant advancement towards technological self-reliance and will boost India’s presence in the global chip ecosystem. The Prime Minister inaugurated the HCL-Foxconn joint venture project, India Chip Private Limited, via video conferencing from the Yamuna Expressway Industrial Development Authority (YEIDA) site in Uttar Pradesh. This new facility, an Outsourced Semiconductor Assembly and Test (OSAT) plant, is being constructed with an investment exceeding Rs 3,700 crore.
The OSAT facility will focus on manufacturing display driver chips utilized in mobile phones, laptops, automobiles, and various consumer electronics. Once operational, the plant is anticipated to process approximately 20,000 wafers per month, aiming to decrease India’s reliance on chip imports and fortify domestic supply chains. Prime Minister Modi referred to this decade as India’s “tech-ade,” emphasizing that investments in semiconductors are laying the groundwork for the nation’s leadership in 21st-century technologies.
Under the India Semiconductor Mission, 10 such units have received approval, with four nearing the commencement of production. PM Modi highlighted the recent India AI Impact Summit in Delhi, where global leaders commended India’s technology vision. He noted that the new plant is expected to generate numerous direct and indirect job opportunities for engineers, technicians, and skilled workers, while also fostering ancillary industries, startups, and chip design hubs in the region.
