Prime Minister Narendra Modi is set to inaugurate an advanced semiconductor Assembly, Testing, Marking, and Packaging (ATMP) facility in Sanand on Saturday. This inauguration signifies a significant advancement in India’s semiconductor manufacturing goals under the National Semiconductor Mission. The Sanand unit, established by Micron Semiconductor Technology India Pvt. Ltd., has been built with an investment of Rs 22,516 crore.
The facility will be responsible for assembling, testing, marking, and packaging semiconductor memory products, including solid-state drives (SSDs) and RAM-type DRAM and NAND devices for global markets. Currently, a team of 2,000 employees is operational at the plant, with expectations to increase employment to around 5,000 individuals in the near future. The facility also provides job opportunities for People with Disabilities who possess relevant skills as operators and technicians.
Micron Technology’s President and CEO, Sanjay Mehrotra, emphasized the critical role of memory and storage in emerging technologies, particularly in Artificial Intelligence (AI). He highlighted that strong memory and storage support are essential for the proper functioning of AI systems. As AI applications demand faster and real-time responses, the need for advanced memory solutions continues to rise.
The semiconductor manufacturing process for the ATMP facility commences with extracting pure silicon from sand. The silicon is then melted and shaped into cylindrical ingots, which are further sliced into thin wafers. These wafers undergo electronic patterning and layer applications in fabrication plants to create memory structures and transistors. Subsequently, the wafers are cut into individual chips, sent to the Sanand plant for assembly, testing, marking, and packaging before distribution.
