Bhubaneswar, May 29 (IANS) The Odisha government has signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) of the US for the establishment of an Advanced Packaging Substrate Manufacturing Facility in the state — a first-of-its-kind project in India, government officials said on Friday. As per an official statement issued, the facility will leverage advanced glass-based substrate technologies and high-density interconnect packaging, essential for sectors such as AI,…
Trending
- Mareechika (2026) Review: A Psychological Thriller That Weaves Mystery and Emotion Into a Compelling Cinematic Experience
- Krishna Aur Chitthi Review: Arun Govil and Darsheel Safary Deliver a Heartfelt Tale of Faith, Family, and Cricket
- Return Of The Jungle (2026) Movie Review: A Heartwarming Animated Journey Rooted in Indian Storytelling
- Shape of Momo Review: A Breathtaking Portrait of Womanhood, Patriarchy, and Belonging in the Hills of Sikkim
- Rajni Ki Baraat Review (2026): A Bold, Heartwarming Celebration of Female Courage from the Lanes of Darbhanga
- Shree Baba Neeb Karori Maharaj (2026) Movie Review: A Devotional Journey That Touches the Soul
- The Great Grand Superhero Review: Jackie Shroff’s Desi Superhero Saga Is Pure Heart and Chaos
- Ego Raman (2026) Movie Review: A Quiet Psychological Drama That Dares to Go Dark