New Delhi, July 17 (IANS) India’s semiconductor push is expected to create 1.5 lakh-2 lakh direct and indirect jobs over the next five years while transforming the country’s electronics industry from an assembly-led manufacturing base into a global hub for chip design, engineering and innovation, industry said on Friday.According to analysis of NLB Services, the next phase of the semiconductor mission will go beyond manufacturing and focus on building an integrated ecosystem spanning chip design…
Latest Advanced packaging News & Updates
Bhubaneswar, May 29 (IANS) The Odisha government has signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) of the US for the establishment of an Advanced Packaging Substrate Manufacturing Facility in the state — a first-of-its-kind project in India, government officials said on Friday. As per an official statement issued, the facility will leverage advanced glass-based substrate technologies and high-density interconnect packaging, essential for sectors such as AI,…