Bhubaneswar, May 29 (IANS) The Odisha government has signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) of the US for the establishment of an Advanced Packaging Substrate Manufacturing Facility in the state — a first-of-its-kind project in India, government officials said on Friday. As per an official statement issued, the facility will leverage advanced glass-based substrate technologies and high-density interconnect packaging, essential for sectors such as AI,…
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