The Odisha government has partnered with Intel and 3D Glass Solutions from the US to establish an Advanced Packaging Substrate Manufacturing Facility in the state. This project, a first of its kind in India, will focus on advanced glass-based substrate technologies crucial for sectors like AI, high-performance computing, and telecommunications.
Intel will play a key role as the technology partner, offering process expertise, technology licensing, quality systems, and workforce capability building. The project, set to be executed in phases, is anticipated to attract a foreign direct investment of around $3.3 billion, significantly boosting Odisha’s industrial landscape.
The facility, to be located in Bhubaneswar in Khordha district, will feature top-notch cleanrooms, fabrication units, testing infrastructure, and research and development facilities. By venturing into advanced packaging, Odisha aims to position itself at the forefront of the global semiconductor value chain, fostering high-value industrial growth and innovation.
This strategic move aligns with Odisha’s economic goals of reaching a $500 billion economy by 2036 and a $1.5 trillion economy by 2047. The project is expected to not only create direct high-skilled job opportunities but also catalyze the development of a comprehensive semiconductor ecosystem in the state.
