Bhubaneswar, May 29 (IANS) The Odisha government has signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) of the US for the establishment of an Advanced Packaging Substrate Manufacturing Facility in the state — a first-of-its-kind project in India, government officials said on Friday. As per an official statement issued, the facility will leverage advanced glass-based substrate technologies and high-density interconnect packaging, essential for sectors such as AI,…
Latest Cleanrooms News & Updates
Gandhinagar, Feb 27 (IANS) Prime Minister Narendra Modi is scheduled to inaugurate Micron Technology’s advanced semiconductor facility at Gujarat’s Sanand on Saturday, which features one of the world’s largest cleanrooms for chip manufacturing.The facility marks a major step in strengthening India’s semiconductor manufacturing capabilities.The Phase‑1 cleanroom at the Sanand plant spans five lakh square feet.Speaking ahead of the inauguration, Sanjay Mehrotra, Chairman, President and Chi…