New Delhi, May 29 (IANS) The Odisha government has signed a memorandum of understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to bring substrate manufacturing technology to India, according to Union Minister for Electronics and Information Technology Ashwini Vaishnaw on Friday.Vaishnaw congratulated the state government, Intel and 3DGS on signing the pact aimed at introducing substrate manufacturing capabilities in India through a post on social media platform X.”Congratulations to the …
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