Prime Minister Narendra Modi will participate in the groundbreaking ceremony of the Rs 3,700 crore HCL-Foxconn joint venture project, India Chip Pvt. Ltd., near the Noida International Airport in Jewar, Uttar Pradesh on February 21 through video conferencing. This semiconductor facility by Foxconn and HCL Group signifies a significant step towards India’s technological self-reliance and the vision to establish the country as a global hub for high-end electronics manufacturing. The project, under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), aims to enhance domestic manufacturing capabilities and reduce import reliance.
The establishment of the Outsourced Semiconductor Assembly and Test (OSAT) facility at YEIDA is part of the government’s strategy to strengthen local manufacturing, decrease import dependency, and develop resilient global supply chains. It is anticipated to support various sectors including mobile phones, tablets, laptops, automotive, and consumer electronics. This initiative is set to boost India’s semiconductor ecosystem, promoting innovation, skill development, and technology transfer while creating numerous job opportunities for engineers and professionals.
The HCL-Foxconn joint venture highlights India’s growing presence in the global semiconductor industry and signifies a significant advancement in establishing a self-reliant electronics manufacturing ecosystem. Foxconn, with a 40% equity stake in the venture, has already invested $37.2 million (around Rs 312 crore) and plans to further invest up to Rs 424 crore. The project, located in Sector 28, Jewar, near the upcoming Noida International Airport, will host an outsourced semiconductor assembly and test plant focusing on display driver integrated circuits for smartphones, laptops, and automotive applications.
