Seoul, May 29 (IANS) Samsung Electronics said on Friday it has begun shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the world’s first shipment of the next-generation artificial intelligence (AI) memory product.The move comes just three months after Samsung became the first company to begin mass production and shipments of sixth-generation HBM4 chips in February, underscoring its efforts to strengthen its leadership in the rapidly growing AI memory ma…
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