Samsung Electronics has commenced the shipment of samples for its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, which is the world’s first of its kind for artificial intelligence (AI) applications. This milestone follows Samsung’s earlier achievement of mass producing sixth-generation HBM4 chips in February, reinforcing its position in the rapidly expanding AI memory market. The HBM4E chip boasts superior performance due to optimized design and manufacturing processes, offering data transfer speeds of up to 16 gigabits per second per pin, a 20% improvement over its predecessor.
The new chip also provides a bandwidth of up to 3.6 terabytes per second per stack, facilitating quicker processing for large language models and next-gen AI systems. Samsung’s Head of Memory Development, Hwang Sang-joon, highlighted the company’s technological prowess by successfully completing the shipment of next-gen HBM4E samples without interruptions. The company plans to move towards mass production of the HBM4E in accordance with customer timelines subsequent to the sample deliveries.
Samsung’s clientele includes prominent AI firms like Advanced Micro Devices (AMD), Nvidia, and Google. In other news, South Korean stocks saw an uptick as reports emerged of an agreement between the United States and Iran to extend their ceasefire. The Korea Composite Stock Price Index (KOSPI) surged by 2.33% to 8,376.05, driven by positive investor sentiment. The market reacted positively to news of a 60-day extension of the ceasefire between Washington and Tehran, with Wall Street also experiencing record highs.
Samsung Electronics, a key player in the market, witnessed a 4.34% increase in its stock value, while its chipmaking rival SK hynix saw a 1.4% rise in stock prices.
