Chief Minister Mohan Charan Majhi highlighted Odisha’s emergence as an attractive destination for the global semiconductor industry, citing the state’s resources, talent, infrastructure, and determination. The inauguration of India’s first Advanced 3D Glass substrate packaging facility by 3D Glass Solutions at Infovally in Bhubaneswar marked a significant milestone. The project, with an investment of about Rs 2,000 crore, is set to produce 70,000 glass panels annually, along with 50 million assembled units and 13,200 advanced 3DHI modules.
The event, graced by Union Electronics and IT Minister Ashwini Vaishnaw and Odisha Electronics and Information Technology Minister Dr. Mukesh Mahaling, is expected to create approximately 2,500 job opportunities in the state. Chief Minister Majhi emphasized the project’s importance in India’s technological advancement, especially in sectors like artificial intelligence, high-performance computing, and defense electronics. He underlined Odisha’s appeal to the global semiconductor industry, pointing out the state’s natural resources, infrastructure, skilled workforce, connectivity, and governance as key factors.
Majhi encouraged the youth of Odisha to seize the opportunities in the emerging sector by acquiring relevant skills. Noting investments exceeding Rs 10,000 crore in Odisha’s semiconductor industry, he highlighted the presence of companies like RIR Power Electronics and SiCSem in the state. The Chief Minister reiterated Odisha’s role in realizing the vision of an Atmanirbhar Bharat under Prime Minister Narendra Modi’s leadership, positioning the state as a pivotal hub for eastern India. Union Minister Vaishnaw expressed commitment to industrialize Odisha further and transform it into an IT hub in the upcoming years.
