Bhubaneswar, May 29 (IANS) The Odisha government has signed a Memorandum of Understanding (MoU) with Intel and 3D Glass Solutions (3DGS) of the US for the establishment of an Advanced Packaging Substrate Manufacturing Facility in the state — a first-of-its-kind project in India, government officials said on Friday. As per an official statement issued, the facility will leverage advanced glass-based substrate technologies and high-density interconnect packaging, essential for sectors such as AI,…
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New Delhi, May 29 (IANS) The Odisha government has signed a memorandum of understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to bring substrate manufacturing technology to India, according to Union Minister for Electronics and Information Technology Ashwini Vaishnaw on Friday.Vaishnaw congratulated the state government, Intel and 3DGS on signing the pact aimed at introducing substrate manufacturing capabilities in India through a post on social media platform X.”Congratulations to the …
Bhubaneswar, April 19 (IANS) Chief Minister Mohan Charan Majhi on Sunday said that Odisha has emerged as an ideal destination for the global semiconductor industry, due to its resources, talent, infrastructure, and determination. CM Majhi was speaking at the foundation stone laying ceremony of India’s first Advanced 3D Glass substrate packaging facility Unit by 3D Glass Solutions at Infovally in Bhubaneswar.The foundation stone was laid in the presence of Union Electronics and IT Minister Ashw…